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I N T R O D U C T I O N
OPTICAL METHODS AND FRP
0.1. Digital Image
A digital image is a representation of a two-dimensional image using
ones and zeros, binary code. Depending on whether or not the image
resolution is fixed, it may be of vector or raster type. Without
qualifications, the term digital image usually refers to raster images also
called bitmap images, figure 0.1.
Fig. 0.1 – Basic concept of digital image correlation
Raster images have a finite set of digital values, called picture elements or
pixels. The digital image contains a fixed number of rows and columns of
pixels.
Pixels are the smallest individual element in an image, holding quantized
values that represent the brightness of a given color at any specific point.
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Typically, the pixels are stored in computer memory as a raster image or
raster map, a two-dimensional array of small integers. These values are
often transmitted or stored in a compressed form.
Raster images can be created by a variety of input devices and techniques,
such as digital cameras, scanners, coordinate-measuring machines,
seismographic profiling, airborne radar, and more.
They can also be synthesized from arbitrary non-image data, such as
mathematical functions or three-dimensional geometric models; the latter
being a major sub-area of computer graphics. The field of digital image
processing is the study of algorithms for their transformation.
Each pixel of a raster image is typically associated to a specific position in
some 2D region, and has a value consisting of one or more quantities
related to that position.
Digital images can be classified according to the number and nature of
those samples:
binary;
grayscale;
color;
false-color;
multi-spectral;
thematic;
picture function.
The term digital image is also applied to data associated to points scattered
over a three-dimensional region.
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0.2. Digital Image Correlation
This dissertation concern the use of optical methods, in particular
digital image correlation, for displacement measurements during static or
fatigue tests on specimens.
The accurate measurement of displacement and strains during deformation
of advanced materials and devices continues to be a primary challenge to
designers and experimental mechanicians. The increasing complexity of
technological devices with stringent space requirements leads to imperfect
boundary conditions that have to be properly accounted for. The push
toward miniaturizing devices down to nanometer length scales imparts
additional difficulties in measuring strains as the application of
conventional extensometers and resistance foil gages are cumbersome,
damaging, or even impossible. Compounding this problem is also the fact
that compliance of small-scale testing machines precludes the use of the
displacement of external actuators for estimating specimen strain. As a
consequence, a technique with the following features is extremely
desirable:
no contact with the specimen required;
sufficient spatial resolution to measure locally at the region of
interest;
the ability to capture non-uniform full-field deformations;
a direct measurement that does not require recourse to a numerical
or analytical model.
Optical methods are a logical solution to this litany of challenges.
One approach is the interferometric strain-displacement gage developed by
Sharpe. A laser-based technique that affords significant advantages over
conventional strain measurement methods.
It utilizes two markers on the surface of the specimen that provide
interference fringes. This technique offers a very good resolution and local
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strain determination, but is limited to 1D measurements and requires some
degree of experimental complexity. It also demands the use of markers.
In the case of thin film mechanical testing where thicknesses are in the
submicrometre range, hardness indents are out of the question and
deposited lines can be up to an order of magnitude thicker than the
specimen itself, which could significantly alter the apparent intrinsic
properties of the material being tested.
Digital image correlation techniques have been increasing in popularity,
especially in micro- and nano-scale mechanical testing applications due to
its relative ease of implementation and use.
Advances in digital imaging have been the enabling technology for this
method and while white-light optics has been the predominate approach,
DIC has recently been extended to SEM and AFM. Above and beyond the
ability of image-based methods to provide a “box-seat” to the events that
are occurring during deformation, these techniques have been applied to
the testing of many materials systems because it offers a full-field
description and is relatively robust at tracking a wide range of “markers”
and varying surface contrast.
The appeal of these image-based techniques, coupled with the lack of
flexibility and prohibitive cost of commercial DIC software packages,
provided the impetus for the development of a custom in-house software
suite using the mathematical package MATLAB as the engine for
calculations.
This resulted in an open-source package that was uploaded to the public
domain in an effort to provide free tools to users, but also to generate
feedback for potential improvements and addition to the code.
DIC for strain measurement constitutes a major field of research and is
followed by a healthy, vigorous, and dynamic discussion and discourse.
DIC was first conceived and developed at the University of South Carolina
in the early 1980s and has been optimized and improved in recent years.
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DIC is predicated on the maximization of a correlation coefficient that is
determined by examining pixel intensity array subsets on two or more
corresponding images and extracting the deformation mapping function
that relates the images, Figure 0.2.
Fig. 0.2 – Basic concept of digital image correlation
The cross correlation coefficient
ij
r is defined as:
2
* *
2
* *
) , ( ) , (
) , ( ) , (
1 ) , , , , , (
G y x G F y x F
G y x G F y x F
y
v
x
v
y
u
x
u
v u r
j
j
j i
i
j
j
j i
i
ij
i
x
i
x
Here ) , (
j i
y x F is the pixel intensity or the gray scale value at a point
) , (
j i
y x in the undeformed image. ) , (
* *
j
y x G
i
x
is the gray scale value at a
point ) , (
* *
j
y x
i
x
in the deformed image. F and G are mean values of the
intensity matrices F and G, respectively. The coordinates or grid points
) , (
j i
y x and ) , (
* *
j
y x
i
x
are related by the deformation that occurs between
the two images. If the motion is perpendicular to the optical axis of the
camera, then the relation between ) , (
j i
y x and ) , (
* *
j
y x
i
x
can be
approximated by a 2D affine transformation such as:
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y
y
u
x
x
u
u x x
*
;
y
y
v
x
x
v
v y y
*
.
Here u and v are translations of the center of the sub-image in the x and y
directions, respectively. The distances from the center of the sub-image to
the point ) , ( y x are denoted by x and y . Thus, the correlation
coefficient
ij
r is a function of displacement components ) , ( v u and
displacement gradients:
y
v
x
v
y
u
x
u
; ; ; .
DIC has proven to be very effective at mapping deformation in
macroscopic mechanical testing, where the application of specular markers
or surface finishes from machining and polishing provide the needed
contrast to correlate images well.
However, these methods for applying surface contrast do not extend to the
application of freestanding thin films for several reasons. First, vapor
deposition at normal temperatures on semiconductor grade substrates
results in mirror-finish quality films with roughnesses that are typically on
the order of several nanometers.
No subsequent polishing or finishing steps are required, and unless electron
imaging techniques are employed that can resolve microstructural features,
the films do not possess enough useful surface contrast to adequately
correlate images.
Typically this challenge can be circumvented by applying paint that results
in a random speckle pattern on the surface, although the large and turbulent
forces resulting from either spraying or applying paint to the surface of a
freestanding thin film are too high and would break the specimens. In
addition, the sizes of individual paint particles are on the order of μms,
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while the film thickness is only several hundred nms, which would be
analogous to supporting a large boulder on a thin sheet of paper.
Very recently, advances in pattern application and deposition at reduced
length scales have exploited small-scale synthesis methods including nano-
scale chemical surface restructuring and photolithography of computer-
generated random specular patterns to produce suitable surface contrast for
DIC.
The application of very fine powder particles that electrostatically adhere
to the surface of the specimen and can be digitally tracked is one approach.
For thin films, fine alumina abrasive polishing powder was initially used
since the particle sizes are relatively well controlled, although the adhesion
to films was not very good and the particles tended to agglomerate
excessively.
A light blanket of powder would coat the gage section of the tensile sample
and the larger particles could be blown away gently. The remaining
particles would be those with the best adhesion to the surface, and under
low-angle grazing illumination conditions, the specimen gage section
would appear as shown in Figure 0.3.
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Fig. 0.3 – Basic concept of digital image correlation
While the surface contrast present is not ideal for DIC, the high intensity
ratio between the particles and the background provide a unique
opportunity to track the particles between consecutive digital images taken
during deformation. This can be achieved quite straight forwardly using
digital image processing techniques, although the resolution is always
limited to a single pixel. To attain tracking with subpixel resolution, a
novel image-based tracking algorithm using MATLAB was developed,
dubbed Digital Differential Image Tracking.
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0.3. Differential Digital Image Tracking
The differential digital image tracking method exploits the shape of
these powder particles when digitally imaged in the intensity domain as
shown in Figure 0.2. The resemblance of the particles to mathematical
functions that are adept at describing peak shapes with precise center
locations and broadening allow them to be fit to a given function and thus
tracked.
It is perhaps coincidental that the symmetric normal distribution function
proficiently fits the intensity profiles of the particles. This function can also
be described in two dimensions.
The quality of the Gaussian fit to a peak profile is shown in Figure 0.4.
Fig. 0.4 – Peak profile of marker with corresponding Gaussian fit
First, images are captured during the course of a mechanical test. Second, a
list of image filenames is generated and the image capture times are
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extracted from the original images in order to synchronize the DDIT data
to that of the data acquisition system.
The markers are then automatically detected in the first image by an image
processing algorithm that labels connected components in a binary image
and subsequently, information regarding the size and shape of these
components are extracted.
Particles with properties that do not conform to specifications for ideal
shapes are thrown out, and the remaining markers in the first image are fit
to a Gaussian function using a nonlinear least-squares algorithm in both the
longitudinal and transverse directions.
The normalized residuals of the fit of the peak to the function are
calculated for every peak and again, fits deemed poor as given by the value
of the residual are removed from the analysis.
This process now continues for every image in the sequence, and the result
includes the position of the peak center, which is then post-processed using
a visualization and data analysis script that allows visualization and output
of the quantities of interest. [1]
A digital image correlation process in shown in figure 0.5.
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Fig. 0.5 – Digital image correlation process [2]
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0.4. Application of Digital Image Correlation
Digital Image Correlation offers characterization of material
parameters far into the range of plastic deformation.
Its powerful data analysis tools allow the determination of the location and
amplitude of maximum strain, which are important functions in material
testing.
DIC is also ideal for fracture mechanics investigation. The full-field
measurement delivers exact information about local and global strain
distribution, crack growth, and can be used for the determination of
important fracture mechanics parameters.
The next figure shown typical application for DIC:
Fig. 0.6 – Material properties
Fig. 0.7 – Fracture mechanics
Fig. 0.8 – Component test
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0.5. Resolution of Digital Image Correlation
The resolution that one can achieve in practice using these image-
based techniques depends on a number of factors, including but not limited
to camera resolution, lens optical quality, and marker size and quality.
For a digital image the resolution can be described in many different ways:
pixel resolution: the term resolution is often used as a pixel count in
digital imaging, even though international standards specify that it
should not be so used, at least in the digital camera field. An image
of N pixels high by M pixels wide can have any resolution less than
N lines per picture height, or N TV lines. But when the pixel counts
are referred to as resolution, the convention is to describe the pixel
resolution with the set of two positive integer numbers, where the
first number is the number of pixel columns and the second is the
number of pixel rows. Another popular convention is to cite
resolution as the total number of pixels in the image, typically
given as number of megapixels, which can be calculated by
multiplying pixel columns by pixel rows and dividing by one
million. Other conventions include describing pixels per unit length
or pixels per unit area, such as pixels per inch or per square inch.
None of these pixel resolutions are true resolutions, but they are
widely referred to as such; they serve as upper bounds on image
resolution, figure 0.9.
Fig. 0.9 – different pixel resolution
spatial resolution: the measure of how closely lines can be resolved
in an image is called spatial resolution, and it depends on properties
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of the system creating the image, not just the pixel resolution in
pixels per inch. For practical purposes the clarity of the image is
decided by its spatial resolution, not the number of pixels in an
image. In effect, spatial resolution refers to the number of
independent pixel values per unit length.
Fig. 0.10 – resolution test target
Spectral resolution: color images distinguish light of different
spectra. Multi-spectral images resolve even finer differences of
spectrum or wavelength than is needed to reproduce color. That is,
they can have higher spectral resolution. that is the strength of each
band that is created.
Temporal resolution: movie cameras and high-speed cameras can
resolve events at different points in time. The time resolution used
for movies is usually 15 to 30 frames per second, while high-speed
cameras may resolve 100 to 1000 frame per second. Many cameras